Development of BGA solder joint vibration fatigue life prediction model

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 149-154

  Wong, T E ^a   Reed, B A ^a   Cohen, H M ^a   Chu, D W ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DURABILITY; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; VIBRATIONS (MECHANICAL);

BALL GRID ARRAY; POWER SPECTRAL DENSITIES; ROOT MEAN SQUARE VALUES; STEADY STATE HARMONIC RESPONSE; SURFACE MOUNT PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032630136     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (21)