Finite element modeling of thermal fatigue and damage of solder joints in a ceramic ball grid array package

Journal of Electronic Materials

Volumn 26, Issue 7, 1997, Pages 814-820

  Hong, Bor Zen ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

Ceramic ball grid array (CBGA); Finite element; Ratcheting; Solder joint; Thermal fatigue; Viscoplastic

Indexed keywords

CERAMIC MATERIALS; CREEP; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD ALLOYS; MATHEMATICAL MODELS; PLASTIC DEFORMATION; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; THERMAL STRESS; VISCOPLASTICITY;

CERAMIC BALL GRID ARRAY (CBGA) PACKAGES; RATCHETING;

SOLDERED JOINTS;

EID: 0031185720     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0256-8     Document Type: Article

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