Effect of thermal ageing on the shear strength of lead-free solder joints

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 152-157

  Oliver, J R ^a   Liu, J ^a   Lai, Z ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; FRACTURE; INTEGRATED CIRCUIT MANUFACTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING ALLOYS; THERMODYNAMIC STABILITY; TIN ALLOYS;

LEAD-FREE SOLDERS;

SOLDERED JOINTS;

EID: 0033684979     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)