Wafer level Chip Scale Packaging - solder joint reliability

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 868-875

  Nguyen, L ^a   Kelkar, N ^a   Kao, T ^a   Prabhu, A ^a   Takiar, H ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; RELIABILITY; SOLDERED JOINTS;

CHIP SCALE PACKAGING (CSP);

ELECTRONICS PACKAGING;

EID: 0032318220     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)