Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 6, 2004, Pages 2315-2320

  Liu, Chi Wen ^a   Tsao, Jung Chih ^b   Tsai, Ming Shih ^c   Wang, Ying Lang ^a,d  

^a NATIONAL CHI NAN UNIVERSITY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^d TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; DECOMPOSITION; ELECTROLYTES; ELECTROMIGRATION; ELECTROPLATING; POLYETHYLENE GLYCOLS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHLORIDE IONS; COPPER FILMS; SELF-ANNEALING; WETTABILITY;

WETTING;

EID: 10244229725     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1795831     Document Type: Article

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