Hermeticity and stiction in MEMS packaging

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2002, Pages 136-139

  Jacobs, S Joshua ^a   Miller, Seth A ^a   Malone, Joshua J ^a   McDonald, William C ^a   Lopes, Vincent C ^a   Magel, Lissa K ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIGITAL DEVICES; MOISTURE; STICTION;

DIGITAL MICROMIRROR DEVICE (DMD);

MICROELECTROMECHANICAL DEVICES;

EID: 0036085582     PISSN: 00999512     EISSN: None     Source Type: Journal    
DOI: 10.1109/RELPHY.2002.996625     Document Type: Article

References (11)

1. Digital light processing™ and MEMS: Timely convergence for a bright future
2. Stiction in surface micromachining
3. Effect of surface chemistry on the tribological performance of a MEMS electrostatic lateral output motor
4. A MEMS-based projection display
5. Digital micromirror device (DMD) hinge memory lifetime reliability modeling
6. DMD packages-evolution and strategy
7. Suitability of an epoxy seal for a MEMS package
8. Behavior of the DMD package under mechanical and thermal loads
9. Modeling of adsorption of krypton on silica gel and a molecular sieve