Tether system designed for flip-chip bonded MEMS

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

Volumn 3, Issue , 2003, Pages 101-106

  Laws, Alexander ^a   Faheem, Faheem ^a   Zhang, Huantong ^a   Lee, Y C ^a  

^a University of Colorado   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; COMPACTION; COST EFFECTIVENESS; FLIP CHIP DEVICES; HYDROFLUORIC ACID; MATHEMATICAL MODELS; MECHANICAL ENGINEERING; PRINTED CIRCUIT BOARDS; STRESS CONCENTRATION;

TETHER SYSTEM DESIGNS; THERMAL-COMPRESSION BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 1942472579     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42422     Document Type: Conference Paper

References (9)

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