Post-enabled precision flip-chip assembly for variable MEMS capacitor

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2003, Pages 1927-1930

  Faheem, F F ^a   Hoivik, N D ^a   Lee, Y C ^a   Gupta, K C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ARRAYS; CAPACITORS; FLIP CHIP DEVICES; RESONATORS;

CAPACITOR ARRAYS;

MICROELECTROMECHANICAL DEVICES;

EID: 0041589653     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. See http://www.memsrus.com
2. M. A. Michalicek and V. M. Bright, "Flip-chip fabrication of advanced micromirror arrays," IEEE MEMS. pp. 313-316, 2001.
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4. Z. Feng, W. Zhang, B. Su, K. F. Harsh, K. C. Gupta, V. Bright, and Y.C. Lee, "Design and modeling of RF MEMS tunable capacitors using electro-thermal actuators," 1999 IEEE MTT-S Int. Microwave Symp. Dig., vol. 4, pp. 1507-10, June 1999.
5. N. Hoivik, M.A. Michalicek, Y.C. Lee, K.C. Gupta, and V.M. Bright, "Digitally controllable variable high-Q MEMS capacitor for RF applications" Microwave Symposium Digest, 2001 IEEE MTT-S International, vol.3, pp. 2115-18, 2001.
6. V. Milanovic et al, "Microrelays for batch transfer integration in RF systems," Proc. IEEE Int. Conf. Microelectromechanical Systems, Tokyo, Japan. pp 787-792, 2000.
7. N. Hoivik, J. W. Elam, S. M. George, K.C. Gupta, V. M. Bright and Y.C. Lee, "Atomic Layer Deposition (ALD) Technology for Reliable RF MEMS", IEEE MTT-S 2002 Int. Micro. Symposium, Seattle WA.