RF characterization of a low cost multichip packaging technology for monolithic microwave and millimeter wave integrated circuits

Conference Proceedings of the International Symposium on Signals, Systems and Electronics

Volumn , Issue , 1995, Pages 443-446

  Jayaraj, K ^a   Noll, Thomas E ^a   Singh, Donald ^a  

^a FOSTER MILLER INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LIQUID CRYSTAL POLYMERS; MECHANICAL PERMEABILITY; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MULTICHIP MODULES; PERMITTIVITY; SUBSTRATES; TECHNOLOGY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

LARGE AREA PROCESSING; MILLIMETER WAVE INTEGRATED CIRCUITS; MOISTURE PERMEABILITY; MULTICHIP MODULE TECHNOLOGY; RADIOFREQUENCY CHARACTERIZATION;

ELECTRONICS PACKAGING;

EID: 0029539717     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)