Materials mechanics and thermo-mechanical reliability of flip chip area array packages

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 181-187

  Schubert, Andreas ^a   Dudek, Rainer ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346402845     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)

1. Dudek, R., Vogel, D., Michel, B., 1996, "Mechanical failure in COB-technology using glob-top encapsulation", IEEE Trans. Comp., Packag., Manufact. Technol.-Part C, vol. 19, no. 4, (October 1996), pp. 232-240.
2. Dudek, R., Nylen, M., Schubert, A., Michel, B., Reichl, H., 1997, "An efficient approach to predict solder fatigue life and its application to SM- and area array components", Proc. 47th Electronic Components and Technology Conference, San Jose, USA, May 1997, pp. 462-471.
3. Dudek, R., Scherzer, M., Schubert, A., Michel, B., 1998, "FE-simulation for polymeric packaging materials", IEEE Trans. Comp., Packag., Manufact. Technol.-Part A, vol. 21, no. 2, (June 1998), pp. 301-309.
4. Gektin, V., Bar-Cohen, A., Witzman, S., 1997, "Coffin-Manson based fatigue analysis of underfilled DCA", Proc. InterPack '97, June 15-19, 1997, Mauna Lani, Hawaii, USA, pp. 1655-1661.
5. Goh, T. J., 1998, "Parametric finite element analysis of solder joint reliability of flip chip on board", Proc. 2nd Electronics Packaging Technology Conference, December 8-10, 1998, Singapore, pp. 57-62.
6. Le Gall, C. A., Qu, J., McDowell, D. L., 1996, "Delamination cracking in encapsulated flip chips", Proc. 46th Electronic Components and Technology Conference, Orlando, USA, May 1996, pp. 430-434.
7. Le Gall, C. A., Qu, J., McDowell, D. L., 1997, "Thermomechanical stresses in an underfilled flip chip DCA", Proc. 3rd Intern. Symposium and Exhibition on Advanced Packaging Materials, March 9-12, 1997, Braselton, Georgia, pp. 128-129.
8. Schubert, A., Dudek, R., Auersperg, J., Vogel, D., Michel, B., Reichl, H., 1997a, "Thermo-mechanical reliability analysis of flip chip assemblies by combined microDAC and the finite element method", Proc. InterPack '97, June 15-19, 1997, Mauna Lani, Hawaii, USA, pp. 1647-1654.
9. Schubert, A., Dudek, R., Vogel, D., Michel, B., Reichl, H., 1997b, "Materials mechanics and mechanical reliability of flip chip assemblies on organic substrates", Advancing Microelectronics, vol. 24, No. 4, July/August 1997, pp. 29-32.
10. Schubert, A., Dudek, R., Döring, R., 1998, "Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA", Proc. 2nd Electronics Packaging Technology Conference, December 8-10, 1998, Singapore, pp. 49-56.
11. Schubert, A., Dudek, R., Leutenbauer, R., Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C. P., Tummala, R., 1999, "Do chip size limits exist for DCA ?", Proc. 5th Intern. Symposium and Exhibition on Advanced Packaging Materials, March 14-17, 1999, Braselton, Georgia, in print.
12. Michaelides, St., Sitaraman, S., 1997, "Role of underfilling imperfections on flip-chip reliability", Proc. InterPack '97, June 15-19, 1997, Mauna Lani, Hawaii, USA, pp. 1487-1493.