Role of underfilling imperfections on flip-chip reliability

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1487-1492

  Michaelides, Stelios ^a   Sitaraman, Suresh ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0344926130     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)

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9. Suranarayana D. et al., "Flip-chip Solder Bump Fatigue Life Enhanced by Polymer Encapsulation", Proc. 40th Electron. Compon. Tech. Conf., Vol. 1, pp.338-344, 1990
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11. Zheng, W.C., Harren, S.V., Skipor, A.F., "Thermomechanical Analysis of Flip-Chip-on-Board Electronic Packaging Assembly", International Mechanical Engineering Congress & Exhibition, of the Winter Annual Meeting, Chicago, Illinois, November 6-11, 1994.