Thermomechanical stresses in an underfilled flip chip DCA

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 128-129

  Le Gall, C A ^a   Qu, J ^a   McDowell, D L ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; DIRECT CHIP ATTACH; DISTANCE TO NEUTRAL POINT;

ENCAPSULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PRINTED CIRCUIT BOARDS; RELIABILITY; SEMICONDUCTING SILICON; SOLDERING ALLOYS; STRAIN; STRESS ANALYSIS; STRESSES; THERMAL EXPANSION; THERMAL STRESS;

ELECTRONICS PACKAGING;

EID: 0030712703     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)