Parametric finite element analysis of solder joint reliability of flip chip on board

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 57-62

  Goh, Teck Joo ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELASTOPLASTICITY; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFEROMETRY; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; STRAIN;

FLIP CHIP ON BOARD (FCOB);

ELECTRONICS PACKAGING;

EID: 0032230571     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)