Thermo-mechanical reliability analysis of flip chip assemblies by combined microdac and the finite element method

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1647-1654

  Schubert, Andreas ^a   Dudek, Rainer ^a   Auersperg, Jürgen ^a   Vogel, Dietmar ^a   Michel, Bernd ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042913844     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (17)

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2. Lau, J. H., (Editor), 1996, "Flip Chip Technologies," McGraw-Hill, New York.
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10. Dudek, R., Döring, R., Michel, B., "Nonlinear FE-simulation for packaging applications", The 3rd VLSI Packaging Workshop of Japan, Kyoto, Japan, December 2-4, 1996, pp. 107-110.
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15. Simon, J., Auersperg, J., Schubert, A., Reichl, H., "A computational comparison of different CSP approaches", The 3rd VLSI Packaging workshop of Japan, Kyoto, Japan, December 2-4, 1996, pp. 80-83.
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17. Vogel, D., Auersperg, J., Schubert, A., Michel, B., Reichl, H. , "Deformation Analysis on Flip Chip Solder Interconnects by MicroDAC", Design & Reliability of Solders and Solder Interconnections, Proceedings of a Symposium held during the TMS Annual Meeting at Orlando, February 10-13, 1997, pp. 439-445.