Adsorption of mercaptopropionic acid onto Au(1 1 1): Part II. Effect on copper electrodeposition

Electrochimica Acta

Volumn 49, Issue 1, 2003, Pages 183-189

  Petri, Marc ^a   Kolb, Dieter M ^a   Memmert, Ulrich ^b   Meyer, Heinrich ^b  

^a UNIVERSITY OF ULM   (Germany)

^b ATOTECH DEUTSCHLAND GMBH   (Germany)

Author keywords

Additives; Au(1 1 1); Copper; Defects; Electroplating; Grain refining; Metal deposition; SAM; Self assembly

Indexed keywords

ADDITIVES; ADSORPTION; CARBOXYLIC ACIDS; COPPER; CRYSTAL MICROSTRUCTURE; CYCLIC VOLTAMMETRY; ELECTRIC POTENTIAL; ELECTROPLATING SOLUTIONS; METALLIC FILMS; MOLECULAR ORIENTATION; SCANNING TUNNELING MICROSCOPY; SELF ASSEMBLY; SURFACE REACTIONS;

GRAIN REFINING;

ELECTROPLATING;

EID: 0344117503     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2003.07.011     Document Type: Conference Paper

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