Copper deposition in the presence of surface-confined additives

Journal of the Electrochemical Society

Volumn 144, Issue 1, 1997, Pages 96-105

  Eliadis, Elias D ^a   Nuzzo, Ralph G ^a   Gewirth, Andrew A ^a   Alkire, Richard C ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ATOMIC FORCE MICROSCOPY; COPPER; CYCLIC VOLTAMMETRY; ELECTROCHEMICAL ELECTRODES; GOLD; MOLECULAR STRUCTURE; MORPHOLOGY; NUCLEATION; ORGANIC COMPOUNDS; SULFURIC ACID; X RAY PHOTOELECTRON SPECTROSCOPY;

ALKANETHIOLS; GALVANOSTATIC DEPOSITION; SELF ASSEMBLY MONOLAYERS;

ELECTRODEPOSITION;

EID: 0030736975     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837370     Document Type: Article

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