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Volumn E86-C, Issue 10, 2003, Pages 2129-2136

Parametric Design for Resin Self-Alignment Capability

Author keywords

Joint geometry; MEMS; OE MCMs; Resin; Self alignment; Surface tension

Indexed keywords

MATHEMATICAL MODELS; MICROELECTROMECHANICAL DEVICES; NUMERICAL METHODS; RESINS; SURFACE TENSION;

EID: 0242412423     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (26)
  • 2
    • 0032627353 scopus 로고    scopus 로고
    • Flip-chip packaging using micromachined conductive polymer bumps and alignment pedestals for MOEMS
    • K.W. Oh, C.H. Ahn, and K.P. Roenker, "Flip-chip packaging using micromachined conductive polymer bumps and alignment pedestals for MOEMS," IEEE J. Sel. Top. Quantum. Electron., vol.5, no.1, pp.119-126, 1999.
    • (1999) IEEE J. Sel. Top. Quantum. Electron. , vol.5 , Issue.1 , pp. 119-126
    • Oh, K.W.1    Ahn, C.H.2    Roenker, K.P.3
  • 3
    • 0029307138 scopus 로고
    • Conductive adhesives: A critical review of progress to date
    • May
    • P.G. Harris, "Conductive adhesives: A critical review of progress to date," Soldering & Surface Mount Technology, no.20, pp.19-21, May 1995.
    • (1995) Soldering & Surface Mount Technology , Issue.20 , pp. 19-21
    • Harris, P.G.1
  • 4
    • 0035006683 scopus 로고    scopus 로고
    • Study on self-alignment capability of electrically conductive adhesives (ECAs) for flip-chip application
    • K.S. Moon, J. Wu, and C.P. Wong, "Study on self-alignment capability of electrically conductive adhesives (ECAs) for flip-chip application," 2001 Int. Sym. Adv. Pack. Mater., pp.341-346, 2001.
    • (2001) 2001 Int. Sym. Adv. Pack. Mater. , pp. 341-346
    • Moon, K.S.1    Wu, J.2    Wong, C.P.3
  • 5
    • 0005328432 scopus 로고    scopus 로고
    • Self-alignment process using liquid resin for assembly of electronic or optoelectronic devices
    • Dec.
    • K. Fujimoto, J.M. Kim, and S. Nakata, "Self-alignment process using liquid resin for assembly of electronic or optoelectronic devices," IEICE Trans. Electron., vol.E84-C, no.12, pp. 1967-1974, Dec. 2001.
    • (2001) IEICE Trans. Electron. , vol.E84-C , Issue.12 , pp. 1967-1974
    • Fujimoto, K.1    Kim, J.M.2    Nakata, S.3
  • 6
    • 0036630206 scopus 로고    scopus 로고
    • 3-D highly precise self-alignment process using surface tension of liquid resin material
    • July
    • J.M. Kim, K. Yasuda, Y.E. Shin, and K. Fujimoto, "3-D highly precise self-alignment process using surface tension of liquid resin material," IEICE Trans. Electron., vol.E85-C, no.7, pp.1491-1498, July 2002.
    • (2002) IEICE Trans. Electron. , vol.E85-C , Issue.7 , pp. 1491-1498
    • Kim, J.M.1    Yasuda, K.2    Shin, Y.E.3    Fujimoto, K.4
  • 7
    • 0242640413 scopus 로고    scopus 로고
    • Highly precise positioning method by pull-up model self-alignment process using liquid surface tension
    • Aug.
    • J.M. Kim, K. Yasuda, K. Fujimoto, and S. Nakata, "Highly precise positioning method by pull-up model self-alignment process using liquid surface tension," Quarterly Journal of the JWS, vol.20, no.3, pp.346-354, Aug. 2002.
    • (2002) Quarterly Journal of the JWS , vol.20 , Issue.3 , pp. 346-354
    • Kim, J.M.1    Yasuda, K.2    Fujimoto, K.3    Nakata, S.4
  • 8
    • 0001481987 scopus 로고
    • Geometric optimization of controlled collapse interconnections
    • May
    • L.S. Goldmann, "Geometric optimization of controlled collapse interconnections," IBM J. Res. Dev., vol.13, no.3, pp.251-265, May 1969.
    • (1969) IBM J. Res. Dev. , vol.13 , Issue.3 , pp. 251-265
    • Goldmann, L.S.1
  • 10
    • 0023365885 scopus 로고
    • Optimum bonding shape control of micro-solder joint of IC and LSI
    • R. Satoh, M. Ohshima, K. Hirota, and I. Ishi, "Optimum bonding shape control of micro-solder joint of IC and LSI," J. Jpn. Inst. Metals, vol.51, no.6, pp.553-560, 1987.
    • (1987) J. Jpn. Inst. Metals , vol.51 , Issue.6 , pp. 553-560
    • Satoh, R.1    Ohshima, M.2    Hirota, K.3    Ishi, I.4
  • 13
    • 0026389761 scopus 로고
    • Experiment and modeling of the self-alignment mechanism in flip-chip soldering
    • M. Landry, S.K. Patra, and Y.C. Lee, "Experiment and modeling of the self-alignment mechanism in flip-chip soldering," ASME Manuf. Proc. Mate. Chall. Microelec. Pack., AMD-vol.131/EEP-vol.1, pp.49-56, 1991.
    • (1991) ASME Manuf. Proc. Mate. Chall. Microelec. Pack. , vol.AMD-131-EEP-1 , pp. 49-56
    • Landry, M.1    Patra, S.K.2    Lee, Y.C.3
  • 14
    • 1542390352 scopus 로고
    • Minimum-energy surface profile of solder joints for non-circular pads
    • Anaheim, CA
    • S.K. Patra, S.S. Sritharan, and Y.C. Lee, "Minimum-energy surface profile of solder joints for non-circular pads," ASME Winter Annual Meet., Anaheim, CA, 1992.
    • (1992) ASME Winter Annual Meet.
    • Patra, S.K.1    Sritharan, S.S.2    Lee, Y.C.3
  • 15
    • 0029358567 scopus 로고
    • Design of solder joints for self-aligned optoelectronic assemblies
    • Aug.
    • W. Lin, S.K. Patra, and Y.C. Lee, "Design of solder joints for self-aligned optoelectronic assemblies," IEEE Trans. CPMT-Part B, vol.18, no.3, pp.543-551, Aug. 1995.
    • (1995) IEEE Trans. CPMT-Part B , vol.18 , Issue.3 , pp. 543-551
    • Lin, W.1    Patra, S.K.2    Lee, Y.C.3
  • 16
    • 0029217861 scopus 로고
    • Selection of design and process parameters for non-uniform ball grid arrays
    • S.M. Heinrich, S.A. Schroeder, and P.S. Lee, "Selection of design and process parameters for non-uniform ball grid arrays," Adv. Elec. Pack. 1995, vol.1, no.1, pp.273-288, 1995.
    • (1995) Adv. Elec. Pack. 1995 , vol.1 , Issue.1 , pp. 273-288
    • Heinrich, S.M.1    Schroeder, S.A.2    Lee, P.S.3
  • 17
    • 0030142283 scopus 로고    scopus 로고
    • Improved yield and performance of ball-grid array packages: Design and processing guidelines for uniform and nonuniform arrays
    • May
    • S.M. Heinrich, S. Shakya, Y. Wang, P.S. Lee, and S.A. Schroeder, "Improved yield and performance of ball-grid array packages: Design and processing guidelines for uniform and nonuniform arrays," IEEE Trans. CPMT-Part B, vol.19, no.2, pp.310-319, May 1996.
    • (1996) IEEE Trans. CPMT-Part B , vol.19 , Issue.2 , pp. 310-319
    • Heinrich, S.M.1    Shakya, S.2    Wang, Y.3    Lee, P.S.4    Schroeder, S.A.5
  • 18
    • 0030231011 scopus 로고    scopus 로고
    • A procedure for automated shape and life prediction in flip-chip and BGA solder joints
    • Sept.
    • G. Subbarayan, "A procedure for automated shape and life prediction in flip-chip and BGA solder joints," ASME, J. Elec. Pack., vol.118, pp.127-133, Sept. 1996.
    • (1996) ASME, J. Elec. Pack. , vol.118 , pp. 127-133
    • Subbarayan, G.1
  • 19
    • 0031233476 scopus 로고    scopus 로고
    • The nature of centroidal locus in misaligned flip-chip solder joints
    • Sept.
    • G. Subbarayan and A. Deshpande, "The nature of centroidal locus in misaligned flip-chip solder joints," ASME, J. Elec. Pack., vol.119, no.3, pp.156-162, Sept. 1997.
    • (1997) ASME, J. Elec. Pack. , vol.119 , Issue.3 , pp. 156-162
    • Subbarayan, G.1    Deshpande, A.2
  • 20
    • 0001653023 scopus 로고    scopus 로고
    • Shape prediction of solder bump joint by surface tension analysis and fatigue strength evaluation
    • M. Kitano and M. Honda, "Shape prediction of solder bump joint by surface tension analysis and fatigue strength evaluation," Adv. Elec. Pack. 1997, vol.2, pp.1407-1412, 1997.
    • (1997) Adv. Elec. Pack. 1997 , vol.2 , pp. 1407-1412
    • Kitano, M.1    Honda, M.2
  • 21
    • 0032098648 scopus 로고    scopus 로고
    • Electronic packaging reflow shape prediction for the solder mask defined ball grid array
    • June
    • K.-N. Chiang and W.-L. Chen, "Electronic packaging reflow shape prediction for the solder mask defined ball grid array," ASME., J. Elec. Pack., vol.120, no.2, pp.175-178, June 1998.
    • (1998) ASME., J. Elec. Pack. , vol.120 , Issue.2 , pp. 175-178
    • Chiang, K.-N.1    Chen, W.-L.2
  • 22
    • 0032624354 scopus 로고    scopus 로고
    • Analytical derivation of the self-alignment motion of flip chip soldered components
    • June
    • N. van Veen, "Analytical derivation of the self-alignment motion of flip chip soldered components," ASME, J. Elec. Pack., vol.121, no.2, pp.116-121, June 1999.
    • (1999) ASME, J. Elec. Pack. , vol.121 , Issue.2 , pp. 116-121
    • Van Veen, N.1
  • 23
    • 0032598591 scopus 로고    scopus 로고
    • Shapes and residual forces of BGA interconnects for optimal design in aerospace applications
    • M.A. Verges and M.C. Larson, "Shapes and residual forces of BGA interconnects for optimal design in aerospace applications," Proc. 1999 IEEE Aerospace Conference, vol.2, pp.303-310, 1999.
    • (1999) Proc. 1999 IEEE Aerospace Conference , vol.2 , pp. 303-310
    • Verges, M.A.1    Larson, M.C.2
  • 24
    • 0003681520 scopus 로고    scopus 로고
    • Mathematics Department Susquehanna University
    • K.A. Brakke, Surface Evolver Manual, Mathematics Department Susquehanna University, 1999.
    • (1999) Surface Evolver Manual
    • Brakke, K.A.1
  • 25
    • 0026407890 scopus 로고
    • Modeling of self-alignment mechanism in flip-chip soldering-Part II: Multichip solder joints
    • S.K. Patra and Y.C. Lee, "Modeling of self-alignment mechanism in flip-chip soldering-Part II: Multichip solder joints," IEEE 41st Proc. ECTC, pp.783-788, 1991.
    • (1991) IEEE 41st Proc. ECTC , pp. 783-788
    • Patra, S.K.1    Lee, Y.C.2
  • 26
    • 0027649778 scopus 로고
    • Statistics of solder joint alignment for optoelectronic components
    • Aug.
    • J. McGroarty, P. Børgensen, B. Yost, and C.Y. Li, "Statistics of solder joint alignment for optoelectronic components," IEEE Trans. CHMT, vol.16, no.5, pp.527-529, Aug. 1993.
    • (1993) IEEE Trans. CHMT , vol.16 , Issue.5 , pp. 527-529
    • McGroarty, J.1    Børgensen, P.2    Yost, B.3    Li, C.Y.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.