3-D highly precise self-alignment process using surface tension of liquid resin material

IEICE Transactions on Electronics

Volumn E85-C, Issue 7, 2002, Pages 1491-1498

  Kim, Jong Min ^a   Yasuda, Kiyokazu ^a   Shin, Young Eui ^b   Fujimoto, Kozo ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Chung Ang University   (Japan)

Author keywords

3 D assembly; Fluxless bonding; Joint geometry; OE MCMs; Passive alignment

Indexed keywords

FITS AND TOLERANCES; FLUXES; MULTICHIP MODULES; NUMERICAL METHODS; PROCESS CONTROL; RESINS; SOLDERING; SUBSTRATES; SURFACE TENSION;

LIQUID RESIN MATERIALS;

OPTOELECTRONIC DEVICES;

EID: 0036630206     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (24)

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