A procedure for automated shape and life prediction in flip-chip and bga solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 3, 1996, Pages 127-133

  Subbarayan, G ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMATION; CALCULATIONS; ESTIMATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; RELIABILITY; STRESS ANALYSIS; THREE DIMENSIONAL;

AUTOMATED SHAPE; BALL GRID ARRAY; LIFE PREDICTION; OPTIMAL DESIGN OF FLIP CHIP; RELIABILITY ESTIMATION; SOLDER JOINT GEOMETRY;

SOLDERED JOINTS;

EID: 0030231011     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792142     Document Type: Article

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