Improved yield and performance of ball-grid array packages: Design and processing guidelines for uniform and nonuniform arrays

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 2, 1996, Pages 310-318

  Heinrich, Stephen M ^a   Shakya, Shilak ^a   Wang, Yanhua ^a   Lee, Ping S ^b   Schroeder, Scott A ^c  

^a Marquette University   (United States)

^b Allen Bradley Company   (United States)

^c Rockwell International   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; FATIGUE OF MATERIALS; GEOMETRY; MATHEMATICAL MODELS; PERFORMANCE; RELIABILITY THEORY; SOLDERED JOINTS; SOLDERING; STRAIN; THERMAL CYCLING;

BALL GRID ARRAY PACKAGES; GLOBAL THERMAL MISMATCH LOAD CONDITION; NONUNIFORM ARRAYS; REFLOW PROCESS; RELIABILITY MODELS; SHEAR STRAIN; SOLDER INTERCONNECTS; UNIFORM ARRAYS;

SURFACE MOUNT TECHNOLOGY;

EID: 0030142283     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.496034     Document Type: Article

References (11)

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