Electroless deposition of novel Ag-W thin films

Microelectronic Engineering

Volumn 70, Issue 2-4, 2003, Pages 489-494

  Bogush, V ^a   Inberg, A ^a   Croitoru, N ^a   Dubin, V ^b   Shacham Diamand, Y ^a  

^a TEL AVIV UNIVERSITY   (Israel)

^b INTEL CORPORATION   (United States)

Author keywords

Electroless deposition; Silver; Thin film; Tungsten

Indexed keywords

ELECTROLESS PLATING; MICROSTRUCTURE; SILICA; SILVER; SUBSTRATES;

DEPOSITION RATE;

THIN FILMS;

EID: 0142106886     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00414-3     Document Type: Conference Paper

References (12)

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