Electroless and sputtered silver-tungsten thin films for microelectronics applications

Microelectronic Engineering

Volumn 65, Issue 1-2, 2002, Pages 197-207

  Inberg, A ^a   Ginsburg, E ^a   Shacham Diamand, Y ^a   Croitoru, N ^a   Seidman, A ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

Electrical resistivity; Electroless; Ion beam sputtering (IBS); Silver; Tungsten

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRIC CONDUCTIVITY; ELECTRIC POTENTIAL; ELECTROLESS PLATING; METALLIZING; MICROSTRUCTURE; MOS CAPACITORS; SILVER; SPUTTERING; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

ION-BEAM SPUTTERING (IBS);

MICROELECTRONICS;

EID: 0036891884     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00851-1     Document Type: Article

References (12)

1. Wang Y., Alford T.L. Appl. Phys. Lett. 74:1999;52.
2. Weast R.C., Astle M.J. Handbook of Chemistry and Physics. 61st Edition:1980/1981;E86 CRC Press, Boca Raton, FL.
3. Graedel T.E. J. Electrochem. Soc. 139:1992;1963.
4. Murarka S.P., Guttmann R.J., Kaloyeros A.E., Lanford W.A. Thin Solid Films. 236:1993;257.
5. Wang S.-Q., Mayer J.W. J. Appl. Phys. 67:1990;2932.
6. Wang Y., Alford T.L. Appl. Phys. Lett. 74:1999;52.
7. Wang Y., Alford T.L., Mayer J.W. J. Appl. Phys. 86:1999;5407.
8. Y. Shacham-Diamand, A. Inberg, Y. Sverdlov, N. Croitiru, in: L.T. Romankiw, T. Osaka, Y. Yamazaki, C. Madore (Eds.), Electrochemical Technology Applications in Electronics III, Honolulu, Hawaii, 22-22 October 1999, The Third International Symposium Proceedings 99-34 (1999) p. 172.
9. Shacham-Diamand Y., Inberg A., Sverdlov Y., Croitiru N. J. Electrochem. Soc. 147:2000;3345.
10. Zerbst M. Z. Angew. Phys. 22:1966;30.
11. Sze S.M. Physics of Semiconductor Devices. 1981;395 Wiley, New York.
12. Shacham-Diamand Y., Israel B., Sverdlov Y. Microelectron. Eng. 55:2001;313.