Novel highly conductive silver-tungsten thin films electroless deposited from benzoate solution for microelectronic applications

Journal of the Electrochemical Society

Volumn 150, Issue 5, 2003, Pages

  Inberg, A ^a   Bogush, V ^a   Croitoru, N ^a   Dubin, V ^b   Shacham Diamand, Y ^a  

^a TEL AVIV UNIVERSITY   (Israel)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; ELECTRIC CONDUCTIVITY; ELECTROPLATING SOLUTIONS; MICROELECTRONICS; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SILICA; SILVER; SOLUTIONS; THIN FILMS; TUNGSTEN; ULSI CIRCUITS;

BENZOATE SOLUTION; THIN FILM COMPOSITION; THIN FILM MORPHOLOGY;

ELECTROLESS PLATING;

EID: 0037799429     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1562596     Document Type: Article

References (10)

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