Electroless silver and silver with tungsten thin films for microelectronics and microelectromechanical system applications

Journal of the Electrochemical Society

Volumn 147, Issue 9, 2000, Pages 3345-3349

  Shacham Diamand, Yosi ^a   Inberg, Alexandra ^a   Sverdlov, Yelena ^a   Croitoru, Nathan ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COMPOSITION EFFECTS; CORROSION PROTECTION; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MORPHOLOGY; SCANNING TUNNELING MICROSCOPY; SILVER; THIN FILMS; TUNGSTEN;

ELECTROLESS DEPOSITION;

ELECTRODEPOSITION;

EID: 0034272509     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393904     Document Type: Article

References (4)

1. Y. Shachan-Diamand, V. Dubin, and M. Angyal, Thin Solid Films, 262, 1 (1995).
2. M. J. DeSilva, V. Dubin, and Y. Shacham-Diamand, Advanced Metallization for Copper Deposition for ULSI Conference, MRS Publications, Portland, OR (Oct. 1995).
3. F. P. Perlstein, R. F. Weightman, and R. Wick, Met. Fin., 61, 77 (1963).
4. S. Lopatin, Y. Shacham-Diamand, V. Dubin, and P. K. Vasudev, in Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, H. S. Rathore, R. Singh, R. P. S. Thakur, and S. C. Sun, Editors, PV 97-8, p. 186, The Electrochemical Society Proceedings Series, Pennington, NJ (1997).