Deposition pressure dependence of internal stress in TiN films deposited by filtered cathodic vacuum arc

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 21, Issue 5, 2003, Pages 1609-1615

  Cheng, Y H ^a,c   Tay, B K ^b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; ELECTRON CYCLOTRON RESONANCE; MOLECULAR STRUCTURE; RESIDUAL STRESSES; STOICHIOMETRY; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS;

CATHODIC VACUUM ARCS;

THIN FILMS;

EID: 0142059020     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1590967     Document Type: Conference Paper

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