Influence of substrate bias on the microstructure and internal stress in Cu films deposited by filtered cathodic vacuum arc

Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

Volumn 19, Issue 5, 2001, Pages 2102-2108

  Cheng, Y H ^a   Tay, B K ^a   Lau, S P ^a   Shi, X ^a   Tan, H S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; CRYSTAL STRUCTURE; FILM GROWTH; GRAIN SIZE AND SHAPE; MICROSTRUCTURE; MORPHOLOGY; SUBSTRATES; SURFACE ROUGHNESS; TENSILE STRESS; X RAY DIFFRACTION ANALYSIS;

FILTERED CATHODIC VACUUM ARC;

THIN FILMS;

EID: 0035440108     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1374619     Document Type: Article

References (37)