Modeling of thermal stress in microelectronic and photonic structures: Role, attributes, challenges, and brief review

Journal of Electronic Packaging

Volumn 125, Issue 2 SPEC., 2003, Pages 261-267

  Suhir, E ^a  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTEGRATED OPTOELECTRONICS; MATHEMATICAL MODELS; MICROELECTRONICS; OPTICAL FIBERS; POLYMERS; SOLDERED JOINTS; THERMAL STRESS; THIN FILMS;

COMPUTER AIDED MODELING; PHOTONIC STRUCTURES; PREDICTIVE MODELING; THERMOMECHANICAL BEHAVIOR;

ELECTRONICS PACKAGING;

EID: 0141829903     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1569510     Document Type: Article

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