Simplified engineering approach for the evaluation of thermally induced stresses in bi-material microelectronic structures

International Journal of Microelectronic Packaging Materials and Technologies

Volumn 1, Issue 2, 1998, Pages 97-103

  Mishkevich, Victor ^a   Suhir, Ephraim ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC STRUCTURE; FINITE ELEMENT METHOD; THERMAL STRESS; THERMOELASTICITY;

BI-MATERIAL MICROELECTRONIC STRUCTURES;

MICROELECTRONICS;

EID: 0032304651     PISSN: 10236228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (27)