Modeling of the mechanical behavior of materials in “high-tech” systems: Attributes and review

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 4, 1999, Pages 213-221

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001172513     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2793843     Document Type: Article

References (122)

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45. Suhir, E., 1988d, “Stresses in Dual-Coated Optical Fibers,” ASME Journal of Applied Mechanics, Vol. 55, No. 10.
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57. Suhir, E., and Poborets, B., 1990, “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability,” ASME Journal of Electronic Packaging, Vol. 112, No. 2.
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59. Suhir, E., 1990b, “Stresses in a Coated Fiber Stretched on a Capstan,” Applied Optics, Vol. 29, No. 18.
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67. Suhir, E., 1991c, “Stress Relief in Solder Joints Due to the Application of a Flex Circuit,” ASME Journal of Electronic Packaging, Vol. 113, No. 3.
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84. Suhir, E., 1994c, “Pull Testing of a Glass Fiber Soldered into a Ferrule: How Long Should the Test Specimen Be?” Applied Optics, Vol. 33, No. 19.
85. Suhir, E., 1994d, “Approximate Evaluation of the Interfacial Shearing Stress in Circular Double Lap Shear Joints, with Application to Dual-Coated Optical Fibers,” Int. Journal of Solids and Structures, Vol. 31, No. 23.
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87. Suhir, E., 1995b, “Analysis and Optimization of the Input/Output Fiber Configuration in a Laser Package Design,” ASME Journal of Electronic Packaging, Vol. 117, No. 4.
88. Suhir, E., 1995c, “How Compliant Should a Die-Attachment Be to Protect the Chip from Substrate (Card) Bowing?” ASME Journal of Electronic Packaging, Vol. 117, No. 1.
89. Suhir, E„ 1995d, “Shock Protection with a Nonlinear Spring,” IEEE CPMT Transactions, Advanced Packaging, Part B, Vol. 18, No. 2.
90. Suhir, E., 1996a, “Predicted Curvature and Stresses in an Optical Fiber Interconnect Subjected to Bending,” IEEE/OSA Journal of Lightwave Technology, Vol. 14, No. 2.
91. Suhir, E., 1996b, “Dynamic Response of a One-Degree-of-Freedom Linear System to a Shock Load During Drop Tests: Effect of Viscous Damping,” IEEE CPMT Transactions, Part A, Vol. 19, No. 3.
92. Suhir, E., 1996c, “Shock-Excited Vibrations of a Conservative Duffing Oscillator With Application to Shock Protection in Portable Electronics,” Int. Journal of Solids and Structures, Vol. 33, No. 24.
93. Suhir, E., Shiratori, M., Lee, Y. C., and Subbarayan, G., eds., Advances in Electronic Packaging, Vol. 1 and 2, ASME, New York.
94. Suhir, E., 1997a, Applied Probability for Engineers and Scientists, McGraw Hill, New York.
95. Suhir, E., 1997b, “Predicted Thermal Mismatch Stresses in a Cylindrical BiMaterial Assembly Adhesively Bonded al the Ends,” ASME Journal of Applied Mechanics, Vol.64, No. 1.
96. Suhir, E., 1997c, “Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman Equations with Consideration of Thermoelastic Strains,” Int. Journal of Solids and Structures, Vol. 34, No. 12.
97. Suhir, E., 1997d “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure,” Proceedings, IMAPS/NATO Workshop, Bled, Slovenia.
98. Suhir, E., 1997e, “Probabilistic Approach to Evaluate Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly,” IEEE CPMT Transactions, Part A, Vol. 20, No. 1.
99. Suhir, E., 1997f, “Is the Maximum Acceleration an Adequate Criterion of the Dynamic Strength of a Structural Element in an Electronic Product?” IEEE CPMT Transactions, Part A, Vol. 20, No. 4.
100. Suhir, E., 1997g, “Bending of a Partially Coated Optical Fiber Subjected to the Ends Off-Set,” IEEE/OSA Journal of Lightwave Technology, Vol. 12, No. 2.
101. Suhir, E., Fukuda, M., Kurkjian, C. R., eds, 1998, Reliability of Photonics Materials and Structures, Proceedings, MRS Symposia, Vol. 531.
102. Suhir, E., Michel, B., Kishimoto, K., Lu, J., eds., 1998, Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, Workshop Proceedings, ASME, New York.
103. Suhir, E., 1998a, “Fiber Optic Structural Mechanics — Brief Review,” editor’s note, ASME Journal of Electronic Packaging, Vol. 120, No. 3, pp. 217 - 220.
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108. Suhir, E., 1998f, “Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?” presented at the Int. Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29 - Dec. 2, 1998, ASME, New York.
109. Suhir, E., 1998g, “Bending Stress in an Optical Fiber Interconnect Experiencing Significant Ends Off-Set,” Proceedings, MRS Symposia, Vol. 531.
110. Suhir, E., 1998h, “Optical Fiber Interconnect Subjected to a Not Very Small Ends Off-Set: Effect of the Reactive Tension,” Proceedings, MRS Symposia, Vol. 531.
111. Suhir, E., 1998i, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends and ‘Piecewise Continuous’ Adhesive Layer: Predicted Thermal Stresses and Displacements in the Adhesive,” Int. Journal of Solids and Structures, in press.
112. Suhir, E., 1998j, “Adhesively Bonded Assemblies with Identical Nondeformable Adherends: Modeling of the Induced Thermal Stresses in the Adhesive Layer,” Composite Interfaces, in press.
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114. Suhir, E., 1999b, “Natural Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board,” IEEE CPMT Transactions, in press.
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