Advances in scanning SQUID microscopy for die-level and package-level fault isolation

Microelectronics Reliability

Volumn 43, Issue 9-11, 2003, Pages 1657-1662

  Knauss, L A ^a   Orozco, A ^a   Woods, S I ^a   Cawthorne, A B ^a  

^a Neocera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; LEAKAGE CURRENTS; MICROSCOPIC EXAMINATION; REFLECTOMETERS;

IMAGING CURRENTS; TIME-DOMAIN REFLECTOMETRY;

SQUIDS;

EID: 0042694379     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00296-8     Document Type: Conference Paper

References (12)

1. Knauss LA, et al. Detecting power shorts from front and backside of IC packages using scanning SQUID microscopy. Proceedings of the 25th International Symposium on Testing and Failure Analysis, Santa Clara, California, November 1999. p. 11.
2. Dias Rajen, Skogulnd Lars, Wang Zhiyong, Smith David. Integration of SQUID microscopy into FA flow. Proceedings of the 27th International Symposium on Testing and Failure Analysis, Santa Clara, California, November 2001.
3. Vallett David P. Scanning SQUID microscopy for die level fault isolation. Proceedings of the 28th International Symposium on Testing and Failure Analysis, Phoenix, Arizona, 3-7 November 2002. p. 391-396.
4. Ouellette J. Failure analysis in a nanometer world. The Industrial Physicist 1998; June: 11.
5. Knauss LA, et al. Backside fault isolation using a magnetic field imaging system on SRAMs with indirect shorts. Proceedings of the 26th International Symposium on Testing and Failure Analysis, Bellevue, Washington, 12-16 November 2000. p. 503-507.
6. Wills Kendall Scott, Diaz de Leon Omar, Ramanujachar Kartik, Todd Charles. Superconducting quantum interference device technique: 3-D localization of a short within a flip chip assembly. Proceedings of the 27th International Symposium on Testing and Failure Analysis, Santa Clara, California, November 2001.
7. th IPFA, Singapore, 2001. p. 202-205.
8. Weinstock H (ed.). SQUID sensors: fundamentals, fabrication, and applications. The Netherlands: Kluwer Academic Publishers; 1996.
9. Wikswo, Jr. JP. The magnetic inverse problem for NDE", in Weinstock H (ed.). SQUID sensors: fundamentals, fabrication, and applications. The Netherlands: Kluwer Academic Publishers; 1996. p. 629-695.
10. Fleet EF, Chatraphorn S, Wellstood FC, Knauss LA. HTS scanning SQUID microscopy of active circuits. IEEE Transactions on Applied Superconductivity 1999; 9(2): 4103.
11. Knauss LA, et al. Scanning SQUID microscopy for current imaging. Microelectronics Reliability 1991; 41: 1211-1229.
12. Schrag BD, Xiao Gang. Submicron electrical current density imaging of embedded microstructures. Applied Physics Letters 2003;82(19): 3272-3274.