Super-conducting Quantum Interference Device Technique: 3-D Localization of a Short within a Flip Chip Assembly

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2001, Pages 69-76

  Wills, Kendall Scott ^a   De Leon, Omar Diaz ^a   Ramanujachar, Kartik ^a   Todd, Charles ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP PACKAGING; TIME DOMAIN REFLECTOMETRY (TDR) ANALYSIS;

ASSEMBLY; DATA ACQUISITION; DEFECTS; DEMAGNETIZATION; ELECTRONIC EQUIPMENT TESTING; FAILURE ANALYSIS; HEAT EXCHANGERS; JOSEPHSON JUNCTION DEVICES; MAGNETIC FIELD EFFECTS; MAGNETIC MATERIALS; NONDESTRUCTIVE EXAMINATION; SQUIDS;

FLIP CHIP DEVICES;

EID: 1542330668     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Comparative TDR Analysis as a Packaging FA Tool, C. Odegard, et al., ISTFA 1999, Pages 49 - 56.
2. Detecting Power Shorts From Front and Backside of IC Packages Using Scanning SQUID Microscopy, L. A. Knauss, et al, ISTFA 1999, Pages 11 - 18.