Backside Fault Isolation Using a Magnetic-Field Imaging System on SRAMs with Indirect Shorts

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 503-507

  Knauss, L A ^a   Frazier, B M ^a   Cawthorne, A B ^a   Budiarto, E ^a   Crandall, R ^a   Melnik, S ^a   Bennett, C ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRONICS PACKAGING; FAILURE ANALYSIS; IMAGING SYSTEMS; INFRARED IMAGING; MAGNETIC FIELDS; MICROSCOPIC EXAMINATION; SHORT CIRCUIT CURRENTS; SQUIDS; STATIC RANDOM ACCESS STORAGE;

INDIRECT SHORTS; MAGNETIC FIELD IMAGING SYSTEMS; POWER SHORTS;

FLIP CHIP DEVICES;

EID: 1542270756     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. J. Ouellette, The Industrial Physicist, p. 11, June 1998.
2. H. Weinstock (ed.), SQUID Sensors: Fundamentals, Fabrication, and Applications, (Kluwer Academic Publishers, The Netherlands), (1996).
3. L.A. Knauss et al., "Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy", ISTFA 99: Proc. 25th Intl. Symp. On Testing and Failure Anal. (Materials Park, OH: ASM International), p. 11 (1999).
4. E.F. Fleet et al., "HTS Scanning SQUID Microscopy of Active Circuits", IEEE Transactions on Applied Superconductivity, 9(2) 4103 (1999).
5. th Intl. Reliability Physics Symp. (IEEE cat.# 00CH37059), p 413 (2000).