Detecting Power Shorts from Front and Backside of IC Packages Using Scanning SQUID Microscopy

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1999, Pages 11-16

  Knauss, L A ^a   Frazier, B M ^a   Christen, H M ^a   Silliman, S D ^a   Harshavardhan, K S ^a   Fleet, E F ^b   Wellstood, F C ^b   Mahanpour, M ^c   Ghaemmaghami, A ^c  

^a Neocera Inc   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PHYSICAL FAILUE ANALYSIS; VOLTAGE CONTRAST ELECTRN MICROSCOPY;

CHIP SCALE PACKAGES; CURRENT DENSITY; ELECTRIC FAULT LOCATION; FAILURE ANALYSIS; FAST FOURIER TRANSFORMS; IMAGING SYSTEMS; LIQUID CRYSTALS; MAGNETIC FIELDS; MAGNETIC MATERIALS; SCANNING ELECTRON MICROSCOPY; SHORT CIRCUIT CURRENTS; SQUIDS;

FLIP CHIP DEVICES;

EID: 1542330884     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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2. World wide patents issued and pending.
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4. E.F. Fleet et al, "HTS Scanning SQUID Microscopy of Active Circuits", Appl. Superconductivity Conference (1998), to be published.
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