Short failure analysis under fault isolation

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2001, Pages 202-205

  Mai, Z H ^a   Palaniappan, M ^a   Chin, J M ^a   Soh, C E ^a   Knauss, L A ^a   Fleet, E F ^a  

^a Device Analysis Lab   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; ELECTRIC PROPERTIES; FAILURE ANALYSIS; IMAGE ANALYSIS; MAGNETIC FIELD EFFECTS; SHORT CIRCUIT CURRENTS; SQUIDS; X RAY MICROSCOPES;

FAULT ISOLATION; PHYSICAL ANALYSIS; REAL TIME X RAY MICROSCOPY; SCANNING ACOUSTIC MICROSCOPY;

INTEGRATED CIRCUIT TESTING;

EID: 0034820228     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Scanning SQUID microscopy
2. Detecting power shorts from front and backside of IC packages using scanning SQUID microscopy