Micro-bias-tees using micromachined flip-chip inductors

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2003, Pages 491-494

  Bell, Patrick J ^a   Hoivik, Nils ^a   Bright, Victor M ^a   Popović, Zoya ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CAPACITORS; ELECTRIC IMPEDANCE; ELECTRIC INDUCTORS; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK TOPOLOGY; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROWAVE DEVICES; NATURAL FREQUENCIES; Q FACTOR MEASUREMENT; SILICON WAFERS;

PARASITIC CAPACITANCES;

FLIP CHIP DEVICES;

EID: 0041663540     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. H. Lakdawala, X. Z. Zhu, H. Luo, S. Santhanam, L. R. Carley, and G. K. Fedder, "Micromachined High-Q Inductors in a 0.18-mm Copper Interconnect Low-K Dielectric CMOS Process," IEEE Journal of Solid-State Circuits, vol. 37, pp. 394-403, Mar. 2002.
2. C.-H. Chen, Y.-K. Fang, C.-W. Yang, and C. S. Tang, "A Deep Submicron CMOS Process Compatible Suspending High-Q Inductor," IEEE Electron Device Letters, vol. 22, pp. 522-523, Nov. 2001.
3. J. Park and M. Allen, "Packaging-Compatible High-Q Microinductors and Microfilters for Wireless Applications," IEEE Transactions on Advanced Packaging, vol. 22, pp. 207-213, May 1999.
4. J.-B. Yoon, K. B.-I, Y.-S. Choi, and E. Yoon, "3-D Construction of Monolithic Passive Components for RF and Microwave ICs Using Thick-Metal Surface Micromachining Technology," IEEE Transactions on Microwave Theory and Techniques, vol. 51, pp. 279-288, Jan. 2003.
5. V. M. Lubecke, B. P. Barber, and L. A. Fetter, "High-Q MEMS for Wireless Integrated Circuits," in 5th International Conference on TELSIKS 2001, vol. 1, Yugoslavia, Sept. 2001, pp. 203-209.
6. L. Fan, R. T. Chen, A. Nespola, and M. C. Wu, "Universal MEMS Platforms for Passive RF Components: Suspended Inductors and Variable Capacitors," in Proceedings of the Eleventh Annual International Workshop on Micro Electro Mechanical Systems, Heidelberg, Germany, Jan. 1998, pp. 29-32.
7. G. W. Dahlmann, E. M. Yeatmann, P. R. Young, I. D. Robertson, and S. Lucyszun, "MEMS High-Q Microwave Inductors Using Solder Surface Tension Self-Assembly," in IEEE International Microwave Symposium Digest, vol. 1, Phoenix, AZ, 2001, pp. 329-332.
8. A. Laws, F. Faheem, H. Zhang, and Y. C. Lee, "Design Rules for MUMPs Tether Flip-Chip Bonded MEMS," Symposium on MEMS/NEMS Packaging, 2003, to be published.
9. A. Singh, D. Horsley, M. Chon, A. Pisano, and R. Howe, "Batch Transfer of Microstructures Using Flip-Chip Solder Bonding," IEEE Journal of Microelectromechanical Systems, vol. 8, pp. 27-33, Mar. 1999.
10. V. Milanović, M. Marharbiz, and K. Pister, "Batch Transfer Integration of RF Microrelays," IEEE Microwave and Guided Wave Letters, vol. 10, pp. 313-315, Aug. 2000.
11. M. Maharbiz, M. Cohn, R. Howe, R. Horowitz, and A. Pisano, "Batch Micropackaging by Compression-Bonded Wafer-Wafer Transfer," in IEEE Conference on Micro Electro Mechanical Systems, 1999, pp. 482-489.
12. K. Harsh, W. Zhang, V. Bright, and Y. Lee, "Flip-Chip Assembly for Si-Based RF MEMS," in Proceedings of the Twelfth IEEE International Conference on Microelectromechanical Systems, Orlando, FL, Jan. 1999, pp. 273-278.
13. "Model 5545 Bias Tee," Picosecond Pulse Labs, May 2001.