MEMS high Q microwave inductors using solder surface tension self-assembly

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2001, Pages 329-332

  Dahlmann, Gerald W ^a   Yeatman, Eric M ^a   Young, Paul R ^b   Robertson, Ian D ^b   Lucyszyn, Stepan ^b  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

^b UNIVERSITY OF SURREY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC INDUCTORS; FREQUENCIES; MICROMACHINING; MICROWAVE DEVICES; PHOTOLITHOGRAPHY; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERING; SUBSTRATES; SURFACE TENSION;

MICROWAVE INDUCTOR; SELF-ASSEMBLY TECHNIQUE; SOLDER PADS;

MICROELECTROMECHANICAL DEVICES;

EID: 0035695545     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2001.966899     Document Type: Article

References (10)

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7. High-performance RF coil inductors on silicon
8. Self-assembly of three-dimensional microstructures using rotation by surface tension forces
9. Surface tension powered self-assembly of 3-D microoptomechanical structures
10. High Q microwave inductors on silicon by surface tension self-assembly