Selective deposition of thin copper films onto silicon with improved adhesion

Electrochemical and Solid-State Letters

Volumn 4, Issue 1, 2001, Pages

  Magagnin, L ^a,b   Maboudian, R ^a   Carraro, C ^a  

^a University of California   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIUM FLUORIDE; ANTISTRESS AGENT; ASCORBIC ACID; CONTINUOUS COPPER FILMS; POLYCRYSTALLINE SILICON;

ADHESION; AMMONIUM COMPOUNDS; COPPER; COPPER COMPOUNDS; DEPOSITION; SILICON; SOLUTIONS; STRUCTURE (COMPOSITION);

THIN FILMS;

EID: 0035131103     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1344280     Document Type: Article

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