Misaligned flip-chip solder joints: Prediction and experimental determination of force-displacement curves

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 227-233

  Josell, D ^a   Wallace, W E ^a   Warren, J A ^a   Wheeler, D ^a   Powell IV, A C ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041369608     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1463732     Document Type: Article

References (21)

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