Finite element modeling of three-dimensional solder joint geometry in SMT

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 2, 1997, Pages 119-126

  Lee, T S ^a   Choi, T P ^b   Yoo, C D ^b  

^a Sogang University   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL; VARIATIONAL TECHNIQUES;

THREE DIMENSIONAL SOLDER JOINT GEOMETRY;

SOLDERED JOINTS;

EID: 0031162039     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792214     Document Type: Article

References (27)

1. Alexander, P. T., and Bello, D. C., 1987, “The Single Key Process Variable in SMT Solder Joint Reliability,” Proc. Expo SMT'87, Las Vegas, NV, pp. 85-89.
2. Batchelor, G. K., 1967, An Introduction to Fluid Mechanics, Cambridge University Press.
3. Bathe, K. J., 1982, Finite Element Procedures in Engineering Analysis, 2nd Ed., Prentice-Hall, Englewood Cliff, N.J.
4. Brakke, K. A., 1992, “Surface Evolver Manual,” version 1.87, The National Science & Technology Research Center for Computation and Visualization of Geometric Structures, University of Minnesota.
5. Charles, H. K., and Clatterbaugh, G. V., 1990, “Solder Joint Reliability- Design Implication from Finite Element Modeling and Experimental Testing,” ASME Journal of Electronic Packaging, Vol. 112, pp. 135-146.
6. Engelmaier, W., 1983, “Effects of Power Cycling on Leadless Chip Carrier Mounting Reliability and Technology,” Electric Packaging and Production, pp. 58-63.
7. Finn, R., 1986, Equilibrium Capillary Surface, Springer-Verlag, New York.
8. Heinrich, S. M., Elkouh, A. F., Nigro, N. J., and Lee, P. S., 1990a, “Solder Joint Formation in Surface Mount Technology-Part I: Analysis,” ASME Journal of Electronic Packaging, Vol. 112, pp. 210-218.
9. Heinrich, S. M., Elkouh, A. F., Nigro, N. J., and Lee, P. S., 1990b, “Solder Joint Formation in Surface Mount Technology-Part II: Design,” ASME Journal of Electronic Packaging, Vol. 112, pp. 219-222.
10. Heinrich, S. M., Liedtke, P. E., Nigro, N. J., Elkouh, A. F„ and Lee, P. S., 1993, “Effect of Chip and Pad Geometry on Solder Joint Formation in SMT,” ASME Journal of Electronic Packaging, Vol. 115, pp. 433-439.
11. Heinrich, S. M., 1994, “Prediction ofSolder Joint Geometry,” Ch.5 of Mechanics of Solder Alloy Interconnects, Frear et al. (eds.), Van Nostrand Reinhold, pp. 158-198.
12. Hildebrand, F. B., 1965, Methods of Applied Mathematics, 2nd Edition, Prentice-Hall, Englewood Cliff, N.J.
13. Hinch, S. W., 1988, Handbook of Surface Mount Technology, Longman Scientific & Technical, New York.
14. Katyl, R. H., 1993, “Calculation of Molten Solder Profile for Rectangular Pad Geometries,” EEP-Vol. 4-2, Advances in Electronic Packaging, ASME, pp. 1095-1101.
15. Klein Wassink, R. J., 1989, Soldering in Electronics, 2nd Ed., Electrochemical Publications Ltd., Ayr Scotland, pp. 46-51.
16. Kreyszig, E., 1993, Advanced Engineering Mathematics, 7th Ed., Wiley, New York.
17. Marcoux, P. P., 1992, Fine Pitch Surface Mount Technology, Van Nostrand Reinhold, New York.
18. Nigro, N. J., Heinrich, S. M., Elkouh, A. F., Zou, X., Fournelle, R., and Lee, P. S., 1993, “Finite Element Method for Predicting Equilibrium Shapes of Solder Joints,” ASME Journal of Electronic Packaging, Vol. 115, pp. 141-146.
19. Nigro, N. J., Zhou, F. J., Fournelle, R. A., Heinrich, H., and Lee, P. S., 1995, “Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints,” EEP-Vol. 10-1, Advances in Electronic Packaging, ASME, pp. 435-449.
20. Patra, S. K., Sritharan, S. S., and Lee, Y. C., 1995, “Quantitative Characterization of a Flip-Chip Solder Joint,” ASME Journal of Applied Mechanics, Vol. 62, pp. 390-397.
21. Private Communication, 1995.
22. Racz, L. M., and Szekely, J., 1993, “Determination of Equilibrium Shapes and Optimal Volume of Solder Droplets in the Assembly of Surface Mounted Integrated Circuits,” ISIJ International, Vol. 33, No. 2, pp. 336-342.
23. Racz, L. M., Szekely, J., and Brakke, K. A., 1993, “A General Statement of the Problem and Description of a Proposed Method of Calculation for Some Meniscus Problems in Material Processing,” ISIJ International, Vol. 33, No. 2, pp. 328-335.
24. Seraphim, D. P., Lasky, R., and Li, C.-Y., 1989, Principles of Electronic Packaging, McGraw Hill, New York.
25. Shah, M. K., 1989, “Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors,” ASME Winter Annual Meeting, Paper 89-WA/EEP-31, San Francisco, CA.
26. Sherry, W. M., and Erich, J. S., 1985, “Analytical and Experimental Analysis of LCCC Solder Joint Fatigue Life,” Proc. 35th Electronic Components Conference, Washington D.C., pp. 81-90.
27. Taylor, J. R., and Pedder, D. J., 1982, “Joint Strength and Thermal Fatigue in Chip Carrier Assembly,” Int. J. Hybrid Microelectronics, Vol. 5