Pre-applied underfills for low cost flip chip processing

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 73-76

  Johnson, C D ^a   Baldwin, D F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); PACKAGING MATERIALS;

APPLICATION METHOD; ASSEMBLY LINE; ENCAPSULANTS; FLIP CHIP ASSEMBLIES; MATERIAL SYSTEMS; PRE-APPLIED UNDERFILLS; PROCESS TECHNOLOGIES; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 84954234787     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757290     Document Type: Conference Paper

References (0)