Dynamic aspects of wetting balance tests

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 3, 1996, Pages 174-183

  Moon, K W ^a   Boettinger, W J ^a   Williams, M E ^a   Josell, D ^a   Murray, B T ^a   Carter, W C ^a   Handwerker, C A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; COMPUTER SOFTWARE; CONTACT ANGLE; FORCE MEASUREMENT; LEAD ALLOYS; MATERIALS TESTING; PHASE EQUILIBRIA; SOLDERING ALLOYS; WETTING;

EUTECTIC SOLDER; LEAD TIN ALLOYS; MARANGONI FLOW; MENISCUS SHAPE; TEMPERATURE GRADIENT EFFECT; WETTING BALANCE TESTS;

SOLDERING;

EID: 0030231280     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792149     Document Type: Article

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