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1
-
-
0030658401
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Industrial fabrication technology for CMOS infrared sensor arrays
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Chicago
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U. Münch, D. Jaeggi, K. Schneeberger, A. Schaufelbühl, O. Paul, H. Baltes, and J. Jasper, "Industrial fabrication technology for CMOS infrared sensor arrays," Digest Tech. Papers Transducers 97, vol. 1, Chicago, 1997, pp. 205-208.
-
(1997)
Digest Tech. Papers Transducers 97
, vol.1
, pp. 205-208
-
-
Münch, U.1
Jaeggi, D.2
Schneeberger, K.3
Schaufelbühl, A.4
Paul, O.5
Baltes, H.6
Jasper, J.7
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2
-
-
84886447992
-
Single-chip CMOS anemometer
-
Washington DC
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F. Mayer, A. Häberli, G. Ofner, H. Jacobs, O. Paul, and H. Baltes, "Single-chip CMOS anemometer," Tech. Digest IEEE Intl. Electron Devices Meeting IEDM 1997, Washington DC, 1997, pp. 895-898.
-
(1997)
Tech. Digest IEEE Intl. Electron Devices Meeting IEDM 1997
, pp. 895-898
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-
Mayer, F.1
Häberli, A.2
Ofner, G.3
Jacobs, H.4
Paul, O.5
Baltes, H.6
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4
-
-
0030710305
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Ultrasound transducer for distance measurements
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Chicago
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M. Hornung, O. Brand, O. Paul, and H. Baltes, "Ultrasound transducer for distance measurements," Digest Tech. Papers Transducers 97, vol. 1, Chicago, 1997, pp. 441-444.
-
(1997)
Digest Tech. Papers Transducers 97
, vol.1
, pp. 441-444
-
-
Hornung, M.1
Brand, O.2
Paul, O.3
Baltes, H.4
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5
-
-
0031163577
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Ultrasound barrier microsystem for object detection based on micromachined transducer elements
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O. Brand, M. Hornung, H. Baltes, and C. Hafner, "Ultrasound barrier microsystem for object detection based on micromachined transducer elements," J. Microelectromechanical Systems, vol. 6, pp. 151-160, 1997.
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(1997)
J. Microelectromechanical Systems
, vol.6
, pp. 151-160
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-
Brand, O.1
Hornung, M.2
Baltes, H.3
Hafner, C.4
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6
-
-
0343210315
-
Thermal CMOS sensors - and overview
-
Weinheim: VCH
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H. Baltes, O. Paul, and D. Jaeggi, "Thermal CMOS sensors - and overview," Sensors Update, vol. 1, Weinheim: VCH, 1996, pp. 121-142.
-
(1996)
Sensors Update
, vol.1
, pp. 121-142
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-
Baltes, H.1
Paul, O.2
Jaeggi, D.3
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7
-
-
0030206050
-
Future of IC microtransducers
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H. Baltes, "Future of IC microtransducers," Sens. Actuators A, vol. 56, pp. 179-192, 1996.
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(1996)
Sens. Actuators A
, vol.56
, pp. 179-192
-
-
Baltes, H.1
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8
-
-
0009388739
-
Micromachined resonant sensors: An overview
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Weinheim: VCH-Wiley, in press
-
O. Brand and H. Baltes, "Micromachined resonant sensors: an overview," Sensors Update, vol. 4, Weinheim: VCH-Wiley, 1998, in press.
-
(1998)
Sensors Update
, vol.4
-
-
Brand, O.1
Baltes, H.2
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9
-
-
0032141810
-
Micromachined thermally-based CMOS microtransducers
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invited review
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H. Baltes, O.Paul, and O. Brand, "Micromachined thermally-based CMOS microtransducers," Proc. IEEE, 1998, invited review.
-
(1998)
Proc. IEEE
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-
Baltes, H.1
Paul, O.2
Brand, O.3
-
10
-
-
0030679948
-
Integrated micromachined decoupled CMOS chip on chip
-
Nagoya
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M. Schneider, T. Müller, A. Häberli, M. Hornung, and H. Baltes, "Integrated micromachined decoupled CMOS chip on chip," Proc. IEEE Workshop on Micro Electro Mechanical Systems MEMS 97, Nagoya, 1997, pp. 512-517.
-
(1997)
Proc. IEEE Workshop on Micro Electro Mechanical Systems MEMS 97
, pp. 512-517
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-
Schneider, M.1
Müller, T.2
Häberli, A.3
Hornung, M.4
Baltes, H.5
-
11
-
-
0031704723
-
Industrial fabrication method for arbitrarily shaped silicon n-well micromechanical structures
-
Heidelberg, in press
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T. Müller, T. Feichtinger, G. Breitenbach, M. Brandl, O. Brand, and H. Baltes, "Industrial fabrication method for arbitrarily shaped silicon n-well micromechanical structures," Proc. IEEE Workshop on Micro Electro Mechanical Systems MEMS 98, Heidelberg, 1998, in press.
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(1998)
Proc. IEEE Workshop on Micro Electro Mechanical Systems MEMS 98
-
-
Müller, T.1
Feichtinger, T.2
Breitenbach, G.3
Brandl, M.4
Brand, O.5
Baltes, H.6
-
12
-
-
33646928081
-
A floating plate structure to determine the heat capacity of CMOS thin films
-
submitted
-
L. Plattner, M. von Arx, O. Paul, and H. Baltes, "A floating plate structure to determine the heat capacity of CMOS thin films," Sens. Materials, 1998, submitted.
-
(1998)
Sens. Materials
-
-
Plattner, L.1
von Arx, M.2
Paul, O.3
Baltes, H.4
-
13
-
-
0031192427
-
A low noise CMOS instrumentation amplifier for thermoelectric infrared detectors
-
C. Menolfi and Q. Huang, "A low noise CMOS instrumentation amplifier for thermoelectric infrared detectors," IEEE J. Solid State Circ., vol. 32, pp. 1-9, 1997.
-
(1997)
IEEE J. Solid State Circ
, vol.32
, pp. 1-9
-
-
Menolfi, C.1
Huang, Q.2
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14
-
-
0009429185
-
IC microtransducers - new components with old materials?
-
Austin, TX
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H. Baltes, D. Lange, and A. Koll, "IC microtransducers - new components with old materials?," Proc. SPIE, vol. 3224, Austin, TX, 1997, pp.2-13.
-
(1997)
Proc. SPIE
, vol.3224
, pp. 2-13
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-
Baltes, H.1
Lange, D.2
Koll, A.3
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16
-
-
0343210302
-
CMOS IC layers: Complete set of thermal conductivities
-
Eds. W. M. Bullis, D. G. Seiler, A. C. Diebold, Woodbury, NY: AIP Press
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O. Paul, M. von Arx, and H. Baltes, "CMOS IC layers: complete set of thermal conductivities," Semiconductor Characterization: Present and Future Needs, Eds. W. M. Bullis, D. G. Seiler, A. C. Diebold, Woodbury, NY: AIP Press, 1995, pp. 197-201.
-
(1995)
Semiconductor Characterization: Present and Future Needs
, pp. 197-201
-
-
Paul, O.1
von Arx, M.2
Baltes, H.3
-
17
-
-
0030383579
-
Simulation toolbox and material parameter data base for CMOS MEMS
-
Nagoya
-
H. Baltes, O. Paul, and J. G. Korvink, "Simulation toolbox and material parameter data base for CMOS MEMS," Proc. 7th Intl. Symposium on Micro Machine and Human Science MHS 96, Nagoya, 1996, pp. 1-8.
-
(1996)
Proc. 7th Intl. Symposium on Micro Machine and Human Science MHS 96
, pp. 1-8
-
-
Baltes, H.1
Paul, O.2
Korvink, J.G.3
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