Long-term thermal stability of Ti/Ai/Mo/Au ohmic contacts on n-GaN

Journal of Electronic Materials

Volumn 32, Issue 5, 2003, Pages 335-340

  Selvanathan, D ^a   Zhou, L ^a   Kumar, V ^a   Adesida, I ^a   Finnegan, N ^b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

GaN; Ohmic contacts; Thermal stability; Ti Al Mo Au

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; AUGER ELECTRON SPECTROSCOPY; CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC RESISTANCE; GALLIUM NITRIDE; OHMIC CONTACTS; THERMODYNAMIC STABILITY;

CONTACT-RESISTANCE;

TITANIUM;

EID: 0038325652     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0154-7     Document Type: Conference Paper

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