A sealing technique for stacking MEMS on LSI using spin-coating film transfer and hot pressing

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 42, Issue 4 B, 2003, Pages 2462-2467

  Sato, Norio ^a   Ishii, Hiromu ^a   Shigematsu, Satoshi ^a   Morimura, Hiroki ^a   Kamei, Toshikazu ^b   Kudou, Kazuhisa ^b   Yano, Masaki ^b   Machida, Katsuyuki ^a   Kyuragi, Hakaru ^a  

^a NTT CORPORATION   (Japan)

^b NTT Advanced Technology Corporation   (Japan)

Author keywords

Dielectric; Integration; LSI; MEMS; Sealing; STP

Indexed keywords

DIELECTRIC MATERIALS; FILMS; HOT PRESSING; IMAGE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATING CIRCUITS; LSI CIRCUITS; MATHEMATICAL MODELS; SEALING (FINISHING); SEMICONDUCTOR DEVICE STRUCTURES; SPIN COATING;

DRIVING FORCE; FILM THICKNESS; FILM TRANSFER; SEAMLESS INTEGRATION TECHNOLOGY;

MICROELECTROMECHANICAL DEVICES;

EID: 0037670938     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.2462     Document Type: Article

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