MEMS fingerprint sensor with arrayed cavity structures

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2001, Pages 913-916

  Sato, N ^a   Machida, K ^a   Morimura, H ^a   Shigematsu, S ^a   Kudou, K ^a   Yano, M ^a   Kyuragi, H ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; SURFACE TOPOGRAPHY; THIN FILMS;

CAVITY STRUCTURE; FINGER PRESSURE; FINGERPRINT SENSOR; PIXELS; SENSING CIRCUIT;

IMAGE SENSORS;

EID: 0035717951     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Novel fingerprint scanning arrays using polysilicon TFT's on glass and polymer substrates
2. A fingerprint sensor based on the feedback capacitive sensing scheme
3. A robust, 1.8 V 250 μW direct-contact 500 dpi fingerprint sensor
4. A new sensor structure and fabrication process for a single-chip fingerprint sensor/identifier LSI
5. A single-chip fingerprint sensor and identifier
6. A pixel-level automatic calibration circuit scheme for sensing initialization of a capacitive fingerprint sensor LSI
7. Novel global planarization technology for interlayer dielectrics using spin on glass film transfer and hot pressing
8. Advanced film transfer system for STP method in planarization technology