Advanced transfer system for spin coating film transfer and hot-pressing in planarization technology

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 3, 2002, Pages 797-801

  Sato, Norio ^a   Machida, Katsuyuki ^a   Kudou, Kazuhisa ^b   Yano, Masaki ^b   Kyuragi, Hakaru ^a  

^a NTT CORPORATION   (Japan)

^b NTT Advanced Technology Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; DIELECTRIC MATERIALS; EQUALIZERS; HOT PRESSING; SILICON WAFERS; THERMAL EFFECTS; THICK FILMS; VACUUM;

FILM TRANSFER SYSTEMS; PRESS FORCE EQUALIZERS;

SPIN COATING;

EID: 0035998595     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1469014     Document Type: Conference Paper

References (8)