Ion solid surface interactions in ionized copper physical vapor deposition

Thin Solid Films

Volumn 422, Issue 1-2, 2002, Pages 141-149

  Liu, X Y ^a   Daw, M S ^b,d   Kress, J D ^c   Hanson, D E ^c   Arunachalam, V ^b   Coronell, D G ^b,e   Liu, C L ^a   Voter, A F ^c  

^a MOTOROLA INC   (United States)

^b MOTOROLA INC   (United States)

^c LOS ALAMOS NATIONAL LABORATORY   (United States)

^d CLEMSON UNIVERSITY   (United States)

^e Reaction Design   (United States)

Author keywords

Copper; Molecular dynamics

Indexed keywords

COPPER; IONIZATION OF SOLIDS; MOLECULAR DYNAMICS; PHYSICAL VAPOR DEPOSITION; SPUTTERING; SURFACE ROUGHNESS;

SOLID SURFACE INTERACTIONS;

METALLIC FILMS;

EID: 0037147263     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00870-2     Document Type: Article

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