Liner conformality in ionized magnetron sputter metal deposition processes

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 4, 1996, Pages 2603-2608

  Hamaguchi, S ^a   Rossnagel, S M ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 24644488361     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.588993     Document Type: Article

References (11)

1. A. V. Gelatos, A. Jain, R. Marsh, and C. J. Mogab, MRS Bull. 19, 49 (1994).
2. S. M. Rossnagel, D. Mikalsea, H. Kinoshita, and J. J. Cuomo, J. Vac. Sci. Technol. A 9, 261 (1991).
3. S. K. Dew, D. Liu, M. J. Brett, and T. Smy, J. Vac. Sci. Technol. B 11, 1281 (1993).
4. R. Joshi and S. Brodsky, Proceedings of the 1992 VLSI Multilevel Interconnect Conference, June 1992 (unpublished), p. 235.
5. S. M. Rossnagel and J. Hopwood, Appl. Phys. Lett. 63, 3285 (1993).
6. S. M. Rossnagel and J. Hopwood, J. Vac. Sci. Technol. B 12, 449 (1994).
7. S. Hamaguchi, M. Dalvie, R. T. Farouki, and S. Sethuraman, J. Appl. Phys. 74, 5172 (1993).
8. S. Hamaguchi and M. Dalvie, J. Vac. Sci. Technol. A 12, 2745 (1994).
9. S. Hamaguchi and M. Dalvie, J. Electrochem. Soc. 141, 1964 (1994).
10. S. Hamaguchi and S. M. Rossnagel, J. Vac. Sci. Technol. B 13, 183 (1995).
11. P. Zalm, Surf. Interface Anal. 11, 1 (1988).