SCOPUS 정보 검색 플랫폼 - 논문 보기

메뉴 건너뛰기

Microelectronics Journal

Volumn 33, Issue 1-2, 2002, Pages 101-105

SU8 resist for low-cost X-ray patterning of high-resolution, high-aspect-ratio MEMS

(1) Khan Malek, Chantal G a,b,c

a CNRS (France)

b UNIVERSITÉ PARIS SACLAY (France)

c LOUISIANA STATE UNIVERSITY (United States)

Author keywords

High aspect ratio; LIGA; MEMS; SU8; Ultra thick photoresist; X ray lithography

Indexed keywords

ASPECT RATIO; MICROSTRUCTURE; PHOTORESISTS; SYNCHROTRON RADIATION; THICK FILMS; X RAY LITHOGRAPHY;

X-RAY PATTERNING;

MICROELECTROMECHANICAL DEVICES;

EID: 0037005964 PISSN: 00262692 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2692(01)00109-4 Document Type: Conference Paper

Times cited : (40)

References (22)

1
- 0027041290
- Fabrication of high depth-to-width aspect ratio microstructures
- Feb
- (1992) Proc. IEEE Micro-Electro-Mech.-Syst. , vol.92 , pp. 93
- Engelmann, G.¹ Ehrmann, O.² Simon, J.³ Reichl, H.⁴

2
- 0007992806
- Yokohama, Japan, June
- (1992) Tech. Digest 7th Int. Conf. Solid State Sensors Actuators , pp. 60
- Allen, M.G.¹

3
- 0038798179
- Micromachining applications of a high resolution utrathick photoresist
- (1995) J. Vac. Sci. Technol. B , vol.13 , Issue.6 , pp. 3012-3016
- Lee, K.Y.¹ LaBianca, N.² Rishton, S.A.³ Zolgharnain, S.⁴ Delorme, J.D.⁵ Shaw, J.⁶ Chang, T.H.-P.⁷

4
- 0031674888
- High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS
- (1998) Sensors Actuators A , vol.64 , pp. 33-39
- Despont, M.¹ Lorenz, H.² Fahrni, N.³ Brugger, J.⁴ Renaud, P.⁵ Vettiger, P.⁶

5
- 0032293166
- Characterization of ultra-thick photoresist for MEMS applications using a 1X stepper
- (1998) SPIE Proc. , vol.3512 , pp. 296-315
- Flack, W.W.¹ Fan, W.P.² White, S.³

6
- 0035278580
- Patterning, electroplating and removal of SU8 moulds by excimer laser micromachining
- (2001) J. Micromech. Microengng , vol.11 , pp. 133-139
- Hayes, J.P.¹ Harvey, E.C.² Sood, D.K.³

7
- 0022717983
- Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process)
- (1986) Microelectronic Engng , vol.4 , pp. 35-56
- Becker, E.W.¹ Ehrfeld, W.² Hagmann, P.³ Maner, A.⁴ Munchmeyer, D.⁵

8
- 85024805910
- Deep X-ray lithography for micromechanics and precision engineering
- (1996) Rev. Sci. Instrum. , vol.67 , Issue.9 , pp. 1-5
- Guckel, H.¹

9
- 0028444046
- Radiation chemistry of poly(lactides) as new polymer resists for the LIGA process
- (1994) J. Micromech. Microengng , vol.4 , pp. 84-93
- Wollersheim, O.¹ Zumaque, H.² Hormes, J.³ Langen, J.⁴ Hoessel, P.⁵ Haussling, L.⁶ Hormes, J.⁷

10
- 0029287970
- Use of photosensitive polyimide for deep X-ray lithography
- (1995) Appl. Phys. Lett. , vol.66 , Issue.16 , pp. 2072-2073
- White, V.¹ Ghodossi, R.² Herdey, C.³ Denton, D.D.⁴ Mc Caughan, L.⁵

11
- 0001892879
- The copolymer of methyl methacrylate and methacrylic acid as a sensitive resist for deep-etch X-ray lithography
- (1996) Microsyst. Technol. , vol.2 , pp. 46-49
- Numazawa, T.¹ Hirata, Y.² Takada, H.³

12
- 0000703272
- Highly sensitive resist material for deep X-ray lithography
- (1998) SPIE Proc. , vol.3049 , pp. 650-658
- Ehrfeld, W.¹ Hessel, V.² Lehr, H.³ Lowe, H.⁴ Schmidt, M.⁵ Schenk, R.⁶

13
- 0031685672
- Mechanical characterization of a new high-aspect-ratio near UV-photoresist
- (1998) Microelectronic Engng , vol.41-42 , pp. 371-374
- Lorenz, H.¹ Laudon, M.² Renaud, P.³

14
- 0000484031
- X-ray microfabrication activities at the center for advanced microstructures and devices
- Workshop1
- (1997) Rev. Sci. Instrum. , vol.67 , Issue.9 , pp. 1-6
- Khan Malek, C.¹ Vladimirsky, Y.² Vladimirsky, O.³ Scott, J.⁴ Craft, B.⁵ Saile, V.⁶

15
- 0031654071
- Multi-level exposures and 3-D X-ray patterning for high aspect ratio microstructures
- (1998) Microelectronic Engng , vol.41-42 , pp. 493-496
- Khan Malek, C.¹ Wood, R.² Dudley, B.³ Ling, Z.⁴ Stadler, S.⁵

16
- 0007898078
- Swelling behaviour of poly(methyl methacrylate) thick resist layers in deep X-ray lithography
- in press
- (2001) J. Synchrotron Rad.
- Khan Malek, C.¹ Das, S.²

17
- 0032293165
- Mask prototyping for ultra-deep-X-ray lithography: Preliminary studies for mask blanks and high-aspect-ratio absorber patterns
- (1998) SPIE Proc. , vol.3512 , pp. 277-285
- Khan Malek, C.¹

18
- 0034985997
- X-ray micromachining of high-aspect-ratio MEMS using SU8 ultra-thick photoresist
- Smart Materials and MEMS Symposium, Melbourne, Australia, Dec. 13-15th, in press
- (2000) SPIE Proc. , vol.4234
- Khan Malek, C.¹

19
- 0000412115
- Use of SU-8 photoresist for very high aspect ratio X-ray lithography
- (2000) Micro-Nano-Engng 1999 , vol.53 , Issue.1-4 , pp. 1493-1496
- Bogdanov, A.L.¹ Peredkov, S.S.²

20
- 0007897903
- SU8 as resist material for deep-X-ray lithography
- (2001) Microsyst. Technol. , pp. 11-16
- Cremers, C.¹ Bouamrane, F.² Singleton, L.³ Schenk, R.⁴

21
- 0033726137
- Preliminary results at the ultradeep X-ray lithography beamline at CAMD
- (2000) SPIE Proc. , vol.4019 , pp. 429-435
- Aigeldinger, G.¹ Coane, P.J.² Craft, B.C.³ Goettert, J.⁴ Ledger, S.⁵ Ling, Z.⁶ Manohara, H.⁷ Rupp, H.⁸

22
- 0001857474
- X-ray masks for very deep X-ray lithography
- (1998) Microsyst. Technol. , vol.4 , Issue.2 , pp. 70-73
- Klein, J.¹ Guckel, H.² Siddons, D.P.³ Johnson, D.E.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.