Multi-level exposures and 3-D X-ray patterning for high-aspect ratio microstructures

Microelectronic Engineering

Volumn 41-42, Issue , 1998, Pages 493-496

  Khan Malek, C ^a   Wood, R ^b   Ling, Z ^a   Dudley, B ^b   Stadler, S ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

^b MCNC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION; MASKS; THREE DIMENSIONAL; X RAY LITHOGRAPHY;

HIGH-ASPECT RATIO; MEMS APPLICATIONS;

MICROSTRUCTURE;

EID: 0031654071     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(98)00115-4     Document Type: Article

References (7)

1. D.P. Siddons, E.D. Johnson, H. Guckel, Synchrotron Radiation News, Vol 7, No 2, 1994, 16.
2. D. Feinerman, R. Lajos, V. White, and D. Denton, J. Microelectromechanical Systems, 5(4), 250 (1996).
3. H. Guckel, Rev. Sci. Instrum. 67(9), 1 (1996).
4. For the Alliance members, see http://mems. mcnc.org/Hiclick. html
5. E. O'Sullivan, E. Cooper, L. T. Romankiw, S. Krongelb, et al., HARMST '97, Madison, WI, June 20-21, 1997.
6. T. W. Tsuei, R. Wood, C. Khan Malek, M. M. Donnelly, and R. B. Fair, HARMST '97, Madison, WI, June 20-21, 1997.
7. W. Smith, "Modern Optical Engineering", McGraw-Hill, 1966.